Power chips are linked to exterior circuits through packaging, and their performance depends on the assistance of the product packaging. In high-power situations, power chips are generally packaged as power modules. Chip interconnection refers to the electric connection on the upper surface area of the chip, which is usually light weight aluminum bonding wire in traditional modules. ^
Traditional power module plan cross-section
Presently, industrial silicon carbide power components still mostly utilize the product packaging modern technology of this wire-bonded traditional silicon IGBT module. They encounter troubles such as huge high-frequency parasitic criteria, inadequate warm dissipation capacity, low-temperature resistance, and not enough insulation strength, which restrict using silicon carbide semiconductors. The screen of excellent performance. In order to resolve these troubles and fully exploit the significant possible advantages of silicon carbide chips, numerous brand-new packaging modern technologies and services for silicon carbide power components have actually arised in recent times.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have created from gold cable bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have developed from gold cords to copper cables, and the driving force is price decrease; high-power gadgets have developed from aluminum wires (strips) to Cu Clips, and the driving force is to improve item efficiency. The better the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a strong copper bridge soldered to solder to link chips and pins. Compared to conventional bonding product packaging approaches, Cu Clip technology has the following advantages:
1. The connection between the chip and the pins is made of copper sheets, which, to a particular extent, changes the conventional cable bonding method in between the chip and the pins. Therefore, a special bundle resistance worth, higher existing flow, and much better thermal conductivity can be obtained.
2. The lead pin welding location does not need to be silver-plated, which can fully save the expense of silver plating and poor silver plating.
3. The item look is totally consistent with normal items and is primarily made use of in web servers, portable computers, batteries/drives, graphics cards, motors, power supplies, and other areas.
Cu Clip has 2 bonding approaches.
All copper sheet bonding approach
Both eviction pad and the Resource pad are clip-based. This bonding technique is extra expensive and complex, however it can accomplish far better Rdson and better thermal effects.
( copper strip)
Copper sheet plus wire bonding method
The source pad utilizes a Clip technique, and eviction uses a Cord technique. This bonding method is somewhat cheaper than the all-copper bonding method, saving wafer area (suitable to really small entrance areas). The process is simpler than the all-copper bonding approach and can get far better Rdson and better thermal effect.
Supplier of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper is a good conductor of electricity, please feel free to contact us and send an inquiry.
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